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tel: +86 189 0616 0161
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email: yeming@wxhuitong.com.cn
Packaging Field
PACKAGING FIELD
At present, we are leading the global packaging market with EPP!
We can provide you with the best packaging solutions in the application, packaging design, product use of products!
Our service is to simplify manufacturing processes, reduce production costs, and minimize environmental impact!
Application solution
▷ lndustrial turnover: Mainly covering auto parts, display, glass panel, new energy battery, semiconductor wafer, PCBAboard, photovoltaic silicon rod, electronic product spare parts, etc. inner turnover or B2B turnover transport
▷ Product packaging: buffer packaging or "integrated’ packaging of technology electronic products, fragile productshigh-end civil goods, etc.
Material Advantage
Multiple cycle use: ln the case of non-human failure, excellent surface resistance to scratch resistance ensures multiplecycles
Unique mechanical properties: combined with rigidity and buffering protection, no need to combine multiplematerials, easy to supply chain management
Customized design: internal structure design, appearance optimization can be achieved by mold
Contact US
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Support order samples, customization, wholesale direct, and complete payment. If the product you look for does not have corresponding customized content, pls fill out the form below to contact us, and we will reply ASAP.